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2.08-inch 256x64 OLED with Laminated Cover Lens, Laminated OLED Display

2.08-inch 256x64 OLED with Laminated Cover Lens, Laminated OLED Display

Model No.
  • HYDL-L0208-080
Resolution
Diagonal Size
Color

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HYDL-L0208-080 is a 2.08-inch OLED display module with 256x64 resolution.

Review the specifications below and contact SWICN to discuss your display requirements.

Datasheet PDF
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This is one example from over 1,000 customized cases we have completed. We offer a wide range of product customization services based on customer requirements.

Our integrated display modules combine components such as cover lenses, touch panels, displays, and driver boards into a single, compact unit-optimized for your application in terms of size, performance, urability, and aesthetics.

We provide customization for:

  • Housing Materials (Plastic or Metal)
  • Cover Lens Options (Glass, PMMA, PC, PET, ABS)
  • Touch Technologies (ITO Glass, ITO Film, Metal Mesh)
  • Display Types (TFT, OLED, EPD)
  • Bonding Techniques (OCA, LOCA, Functional Adhesive Tape)
  • Driver Board & FPC Design
  • Functional Films (Privacy, Anti-glare, Anti-reflection)

From concept to production, our goal is to deliver display solutions that meet your unique design, technical, and environmental needs - whether you’re building consumer electronics, medical equipment, industrial controls, or smart appliances.

To discuss your custom display requirements, please get in touch with our sales representative.

NO. ITEM SPECIFICATIONS UNIT
1 Display Mode 显示模式 PMOLED -
2 Diagonal Size 尺寸 2.08 Inch
3 Resolution 分辨率 256(H)×64(V) Dots
4 Active Area 有效显示区域 51.18(W)×12.78(H) mm
5 Outline Dimension 外围尺寸 98.81(W)×21.25(H) mm
6 Thickness 厚度 1.61±0.15 mm
7 Pixel Pitch 像素间距 0.20 (W)×0.20 (H) mm
8 Pixel Size 像素尺寸 0.18(W)×0.18(H) mm
9 Display Driver IC 显示驱动 IC SH1122G -
10 Touch Driver IC 触控驱动IC No Touch -
11 Display Color 显示色彩 White Color
12 Gray Scale 灰阶 4 bit
13 Brightness 亮度 180 (Typ.) cd/m2
14 Contrast Ratio 对比度 10000:1(Min.) -
15 Interface 接口 4-wire SPI -
16 IC Package Type IC 封装类型 COG -
17 Module Connecting Type 模块连接方式 ZIF Connector -
18 Weight 重量 4.45±10% g
19 Duty占空比 1/64 -
20 Pins 引脚数 14 Pins
21 Operating Temperature 操作温度 -40~70 ℃
22 Storage Temperature 存储温度 -40~85 ℃
Drawings​