Display Options
Display and FPC Selection
| Display Type Options | ![]() |
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|---|---|---|---|---|
| Display Mode | Emissive (OLED) | Transmissive (TFT) | Transflective (TFT) | Reflective (TFT, EPD) |
| Display Operation | Self-illuminating | Requires Backlighting | Uses Backlighting and Ambient Light | Uses Ambient Light |
| Visibility | Good Indoors | Good Indoors | Good Indoors and Outdoors | Good Outdoors |
| Power Efficiency | Higher | Lower | Moderate | Higher |
| Display Quality | Good Color Contrast | Good Color Contrast | Moderate Color Contrast Indoors | Good Color Contrast Indoors |
| Ambient Light | Less Visible in Bright Environments | Less Visible in Bright Environments | Visible in Various Lighting Conditions | Visible in Bright Environments |
| Outdoor Performance | Poor | Poor | Moderate | Excellent |
| Major Applications | Indoor Display Devices, Wearables | Indoor Display Devices, Wearables | Portable Devices, Outdoor Wearables | E-tags, Wearables, Outdoor Displays |
Comparison of Display Interface Protocols
| Interface | Speed | Complexity | Power | Typical Use Case | Remarks |
|---|---|---|---|---|---|
| I²C(Inter-Integrated) | Low (~400kbps) | Simple | Low | Small displays | Slow, configuration only. |
| 3-SPI(3-wire SPI) | Medium (~10Mbps) | Moderate | Low | Small OLEDs | No MISO; unidirectional. |
| 4-SPI(4-wire SPI) | Med-High (~50Mbps) | Moderate | Low | Small/medium TFTs | Bi-directional data. |
| QSPI(Quad SPI) | High (100Mbps+) | Moderate | Medium | Fast updates | Parallel over 4 lines. |
| MCU(8080/6800) | Medium (~20Mbps) | Medium | Med-High | Low-res LCDs | Uses many GPIOs. |
| RGB(Parallel RGB) | High (>100Mbps) | Complex | High | Medium/Large TFTs | Real-time video flow. |
| MIPI DSI(Mobile Proc.) | Very High (Gbps) | Complex | Low | Smartphones | High speed, low power. |
| LVDS(Low Voltage) | Very High (Gbps) | Complex | Medium | Industrial/Laptops | Long-distance stability. |
Summary:
- I²C, SPI, QSPI: Serial interfaces for low to mid-resolution.
- MCU & RGB: Parallel interfaces for controllers/video.
- MIPI DSI & LVDS: High-speed for high-resolution panels.
Lamination Options
Optical Full Lamination
Better Optical Quality (clarity, brightness, contrast)
Stronger Impact Resistance
Better Dust and Water Resistance
OCA Lamination
- (Optical Clear Adhesive) Easier Processing (clean application with OCA sheet) Lower Cost Lower Reliability for Uneven Surface
LOCA Lamination
- (Liquid Optical Clear Adhesive) Harder Processing (difficult residue clearance) Higher Cost Better Reliability for Uneven Surface
Structural Lamination
Lower optical quality (clarity, brightness, contrast)
Weaker Impact Resistance
Weaker Dust and Water Resistance
Lower Processing Efficiency
Frame Lamination
- Harder Processing (hard to hold frame tape) We can also pre-apply double-sided tape (waterproof if necessary) to the back of the laminated cover glass, allowing assembly workers to easily secure the cover glass to the final product.
Gluing Lamination
- We can customize our adhesive bonding solutions to meet client specifications, using different types of adhesives to assemble the cover lens or housing precisely as needed.
Film Lamination
- To meet our customers' demands for higher optical performance, we apply specialized films to the cover glass including: AG Film (Anti-Glare) AF Film (Anti-Fingerprint) Privacy Film Anti-polarizing Film
Touch Solutions
Selecting the right touch solution requires matching structure, controller IC, and firmware tuning with your real application environment.
Touch Sensor Options
Material
Glass, Film
Sensor Type
GG, GF, GFF, Metal Mesh, On-cell, In-cell
Touch Mode
Capacitive, Resistive
Conditions
Regular, Waterproof, Glove Touch
We design custom touch solutions based on each customer’s product structure and performance needs, providing support throughout the debugging and optimization process.
Projected Capacitive (PCAP) Solutions
Application Conditions
Environment
User Interaction
Product Requirements
- Indoor
- Outdoor
- Industrial
- Wet / Humid
- Bare finger
- Gloves
- Multi-touch
- High durability
- Thick glass
- Slim design
Recommended Solutions
Scenario A: Standard Smart Device
Structure: G+F | Controller: Standard IC
Advantages:
- Lower cost, Thinner profile
Scenario B: Multi-touch Device
Structure: G+F+F | Controller: Anti-interference IC
Advantages:
- Smooth interaction, Cost-effective
Scenario C: Industrial Equipment
Structure: G+G | Controller: Industrial IC
Advantages:
- Strong EMI resistance, Durability







